Arrangement of non-signal through vias and wiring board applying the same

摘要

An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact surface, while the arrangement of non-signal through vias includes first non-signal through vias and a second non-signal through via. The first non-signal through vias pass through the core layer and are electrically connected to some of the contact pads. The second non-signal through via which passes through the core layer is disposed between the first non-signal through vias and is not electrically connected to the contact pads. The interval between the second non-signal through via and anyone of the surrounding first non-signal through vias is smaller than or equal to 0.72 times of the minimum interval between the second non-signal through via and one of the contact pads electrically connected to the corresponding first non-signal through vias.