| 摘要 |
<P>PROBLEM TO BE SOLVED: To permit the formation of a bonding wire connecting a long wiring distance with a low loop height, so that the wire will not be contacted with a chip angle upon bonding it by pressure at a second bonding point, and a distance becomes short as much as possible between the chip and the second bonding point. <P>SOLUTION: When a capillary has arrived at the highest point, the capillary is moved so that the bonding wire is provided with bending habit from a first bond point toward the second bond point, and is provided with a camber (D) whose radius of convex curvature is 0.5 mm-3.0 mm, above a part (C) having the bending habit toward the second bond point, while a part positioned above a chip angle after forming a loop is provided with a bending part (E) toward the second bond point with a bending angle of more than 15 degrees. <P>COPYRIGHT: (C)2007,JPO&INPIT |
