| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a micro electro mechanical system which has a thin film for an MEMS structure having a large area to be formed with a simple method, or a cavity having a large area (large volume) and high airtightness for installing the MEMS structure. <P>SOLUTION: A slit or a beam is provided on a lid (or a diaphragm) covering the cavity, and a thin-film internal stress is absorbed and released by deforming it when the cavity is formed. After that, the cavity is sealed by filling up an opening part for communicating the cavity inside with an outside. The space is formed by removing a part of an interlayer film of an LSI multilayer interconnection, and the lid is composed by an LSI process thin film. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
