| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which hardly swells with ACP and NCP and has a good adhesion to a highly conductive silver paste and a circuit board using the composition. SOLUTION: The resin composition contains at least a first resin having a glass transition point of≥80°C, a second resin having a glass transition point lower than that of the first resin and a curing agent. The blend ratio of the first resin to the second resin is 50:50-80:20 by weight. COPYRIGHT: (C)2007,JPO&INPIT
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