发明名称 |
TRANSFER MOLD AND ALIGNMENT METHOD OF TRANSFER MOLD |
摘要 |
PROBLEM TO BE SOLVED: To achieve the reduction of the manufacturing cost of a transfer mold and to enhance the precision of alignment. SOLUTION: The transfer mold F1 for transferring the curable paste of a partition wall forming material to a substrate P used for forming a partition wall is formed by a dicing blade B for processing the transfer mold F1 to form a structure for holding the curable paste and equipped with a truncated pyramid-shaped alignment mark M10 surrounded by inclined side surfaces M10a which forms shadow by reflected or transmitted light of irradiated light. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007210126(A) |
申请公布日期 |
2007.08.23 |
申请号 |
JP20060030001 |
申请日期 |
2006.02.07 |
申请人 |
PIONEER ELECTRONIC CORP |
发明人 |
ITO TOMOJI;KUSUMA YOSHIHIKO;IGARASHI YOICHI |
分类号 |
B29C39/26;B29C33/30;B29C33/38;B29C39/44;H01J11/22;H01J11/34;H01J11/36 |
主分类号 |
B29C39/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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