发明名称 TRANSFER MOLD AND ALIGNMENT METHOD OF TRANSFER MOLD
摘要 PROBLEM TO BE SOLVED: To achieve the reduction of the manufacturing cost of a transfer mold and to enhance the precision of alignment. SOLUTION: The transfer mold F1 for transferring the curable paste of a partition wall forming material to a substrate P used for forming a partition wall is formed by a dicing blade B for processing the transfer mold F1 to form a structure for holding the curable paste and equipped with a truncated pyramid-shaped alignment mark M10 surrounded by inclined side surfaces M10a which forms shadow by reflected or transmitted light of irradiated light. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007210126(A) 申请公布日期 2007.08.23
申请号 JP20060030001 申请日期 2006.02.07
申请人 PIONEER ELECTRONIC CORP 发明人 ITO TOMOJI;KUSUMA YOSHIHIKO;IGARASHI YOICHI
分类号 B29C39/26;B29C33/30;B29C33/38;B29C39/44;H01J11/22;H01J11/34;H01J11/36 主分类号 B29C39/26
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