| 摘要 |
A method for bonding a film, an apparatus for bonding the film, and a method for manufacturing a semiconductor device are provided to prevent breakage of a wafer by using a laser beam upon bonding a die bonding film. A die bonding film(6) is pressed on a wafer(1) on which a surface protective tape is attached by using a film set roller(9a) and a film adhering roller(9b). A laser beam is irradiated on a region between the film set roller and the film adhering roller. The film set roller and the film adhering roller are rotate-moved and, simultaneously, the laser beam scans the wafer. A portion of the die bonding film being fused by the laser beam is pressed using a subsequent film adhering roller to be adhered on the wafer. The die bonding film is fused by the laser beam and then adhered on the wafer so that breakage of the wafer due to thermal contraction of the surface protective tape. |
