CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD

摘要

In a circuit board manufacturing method, a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected. The method includes a first step of bonding the conductor pad with the conductor post by thermocompression under prescribed first conditions, in a status where the first substrate and the second substrate are arranged to have the conductor pad face the conductor post through the interlayer adhesive; a step of performing thermocompression to the first substrate and the second substrate under prescribed second conditions, in a status where the conductor pad is bonded with the conductor post; and a step of performing thermocompression to the first substrate and the second substrate under prescribed third conditions, in the status where the conductor pad is bonded with the conductor post. The first, second and third conditions are different from each other.