METHOD OF BONDING TOGETHER SUPERIOR AND INFERIOR SUBSTRATES OF DISPLAY DEVICE, BONDING APPARATUS AND ELECTRONIC EQUIPMENT

摘要

[PROBLEMS] To realize reduced thickness, reduced weight, high resistance to breaking and prevention of display unevenness occurrence. [MEANS FOR SOLVING PROBLEMS] There is provided a process for producing a display device through bonding together of oppositely disposed substrates, of which at least one is made of a plastic and in roll form, having multiple pixels while at least the other has a drive circuit, comprising at least the seal frame forming step (A) of providing a substrate with seal frame (140) formed using a sealing agent; the liquid crystal forming step (B) of applying liquid crystal (130) into the interior of the seal frame (140) of the substrate; and the substrate bonding step (C) of bonding the substrate with opposite substrate, wherein the substrate bonding step (C) is carried out in such a fashion that any air trapped in the interior of the seal frame (140) is ejected by slowly pressurizing while curving the substrate by means of a pressure application member having flexibility.