| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor encapsulating epoxy resin composition which can use fly ash powder as at least one part of an inorganic filler to reduce the content of an ionic impurity and is excellent in affinity (wettability) between the fly ash powder and various resins, fluidity, and moldability. SOLUTION: The semiconductor encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler, and (x) fly ash powder is used instead of at least one part of the component (C), wherein 10g of the fly ash powder is immersed in 100 ml of pure water at 20°C for 6 hours to give an aqueous extraction solution, which has then a conductivity of 200μS/cm or less, and the fly ash powder has a silanol content ratio [Si-OH]/[Si] of 0.040 or less. COPYRIGHT: (C)2007,JPO&INPIT |
