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经营范围
发明名称
High density lead arrangement structure of leadframe
摘要
申请公布号
KR100751892(B1)
申请公布日期
2007.08.23
申请号
KR20040062097
申请日期
2004.08.06
申请人
发明人
分类号
H01L23/495;H01L23/48
主分类号
H01L23/495
代理机构
代理人
主权项
地址
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