| 摘要 |
<P>PROBLEM TO BE SOLVED: To raise visual recognition in an alignment mark used in a wiring mask process in the manufacturing of a semiconductor device using a via first dual damascene process. <P>SOLUTION: The alignment mark is formed by containing nontransparent metal or a metallic compound. Materials visually recognized to be different in color are arranged in a pattern opening area and a non-opening area of the alignment mark. Then, the alignment mark is obtained by high-visual recognition. Thus, the deviation of alignment is reduced in a mask process so as to raise the yield of a device and reliability. <P>COPYRIGHT: (C)2007,JPO&INPIT |
