| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a semiconductor packaging module with excellent reliability. <P>SOLUTION: The semiconductor packaging module comprises a wiring board 22 including an insulating film non-formation part 27 provided on an insulating film 23, and of a connection land 28 provided on the insulating film non-formation part 27; a semiconductor element 24 mounted on the wiring board 22; solder bumps 25a, 25b connected with the semiconductor element 24, and provided at a position corresponding to the connection land 28; and resin 33 filled in a gap 32 between the semiconductor element 24 and the wiring board 22. The connection land 28 and the solder bumps 25a, 25b are connected with each other via engraved plate transfer conductors 30a, 30b formed by engraved plate transfer. It is hereby possible to suppress the generation of voids in the resin 33 and solder particles. <P>COPYRIGHT: (C)2007,JPO&INPIT |
