| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of effectively manufacturing a semiconductor chip even if the thickness of the semiconductor chip is 100 μm or less. <P>SOLUTION: The manufacturing method of a semiconductor chip comprises a die bond process of bonding a semiconductor chip to the surface of an article to be bonded via a die bonding agent, with an adhesive tape including an adhesive layer containing side chain crystalline polymer on one surface of a supporter as a main component, and the adhesive tape is stuck on the circuit surface; and a process of lowering adhesive force of the foregoing adhesive tape after the die bond process, and peeling the adhesive tape from the circuit surface of the semiconductor chip with a suction jig. The method further includes, between the die bond process and the process of peeling the adhesive tape with a suction jig, a process of pressurizing the entire surface of the supporter of the adhesive tape on which the semiconductor chip is stuck. <P>COPYRIGHT: (C)2007,JPO&INPIT |
