| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device with an excellent heat dissipation and a high reliability, and to provide a method of manufacturing the same. SOLUTION: The electronic device has exothermic electronic parts, a heat spreader or heat sink, and a heat conductive silicon hardened material which is disposed between the heat spreader or heat sink and the exothermic electronic parts; and has a shearing elasticity modulus of 200,000 Pa or less at 25°C, and a heat conductivity of at least 2 W/mK. COPYRIGHT: (C)2007,JPO&INPIT
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