| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that reduces the required time for the entire manufacturing process, prevents damages generated by the packaging due to the thinning of a semiconductor chip, can easily cope with miniaturization and thinning of the device in the packaging of the semiconductor chip, and can reduce the manufacturing cost, and to provide a manufacturing method of the semiconductor device. SOLUTION: The semiconductor chip package of a silicon substrate 1 is subjected to etching machining to form a recessed groove, the semiconductor chip 2 is packaged in the recessed groove in a flip-chip method, a semiconductor chip mount is sealed with a sealing resin 3, and a projection part from the upper surface is polished in the silicon substrate 1 of the semiconductor chip 2. COPYRIGHT: (C)2007,JPO&INPIT
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