| 发明名称 |
Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer |
| 摘要 |
An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at least two adhering areas in the direction in which the adhesive tape is peeled. The porous member adheres to the semiconductor wafer by suction and fixes the wafer in place.
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| 申请公布号 |
US2007197002(A1) |
申请公布日期 |
2007.08.23 |
| 申请号 |
US20040911511 |
申请日期 |
2004.08.05 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KUROSAWA TETSUYA;TAKYU SHINYA |
| 分类号 |
H01L21/00;H01L21/683;H01L21/301;H01L21/50;H01L21/52;H01L21/67;H01L21/68 |
主分类号 |
H01L21/00 |
| 代理机构 |
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