A method of making a microelectronic assembly includes providing a microelectronic package having a substrate 400, a microelectronic element 410 overlying the substrate 400 and at least two conductive elements 418 projecting from a surface 402 of the substrate 400, the at least two conductive elements 418 having surfaces 434 remote from the surface 402 of the substrate 400. The method includes compressing the at least two conductive elements 418 so that the remote surfaces 434 thereof lie in a common plane, and after the compressing step, providing an encapsulant material 430 around the at least two conductive elements 418 for supporting the microelectronic package and so that the remote surfaces 434 of the at least two conductive elements 418 remain accessible at an exterior surface of the encapsulant material 430.
