发明名称 |
Manufacturing method of semiconductor module |
摘要 |
The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other. |
申请公布号 |
US2007197017(A1) |
申请公布日期 |
2007.08.23 |
申请号 |
US20040591723 |
申请日期 |
2004.03.02 |
申请人 |
FUJI ELECTRIC HOLDINGS CO., LTD. |
发明人 |
FUJIMOTO KOZO;WATANABE HIROHIKO;IKEMI KAZUTAKA;MATSUMURA KEIICHI;SHIMODA MASAYOSHI;TANIGUCHI KATSUMI;GOTO TOMOAKI |
分类号 |
H01L21/44;H01L21/60;H01L23/495 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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