| 摘要 |
<p>A probe assembly is provided to implement a probe pin-tape stacked structure by using a conductive section configuring a parallelogram type link mechanism having a parallel spring structure. A probe assembly employs a resin film(25) to which a copper foil is attached. The copper foil is etched to form a conductive section having a vertical probe(12). The probe assembly inspects a circuit of a semiconductor chip by laminating the resin films having the vertical probes and contacting ends of the vertical probes to an electrode pad. A conductive section including the vertical probe configures a parallelogram type link mechanism having a parallel spring structure. The parallelogram type link mechanism has the vertical probe on an end thereof and is a cantilever structure extended to a horizontal direction by using the other end as a supporting unit.</p> |
