| 摘要 |
<p>Provided is a board structure wherein excellent conductivity can be obtained by surely bringing a cover section into contact with a frame body at a plurality of portions and excellent planarity is obtained by preventing curved deformation of the cover section. A method for manufacturing a circuit board is also provided. The board structure (10) is provided with a plurality of electronic components (12) mounted along a base material (11); a frame body (13) surrounding each electronic component (12); a partitioning wall section (18) for partitioning inside the frame body (13) into a first partitioned space (15) and a second partitioned space (16); and a cover section (20) for closing an opening (19) of the frame body (13). The board structure (10) is provided with a plurality of recessed sections (30) arranged on an upper plane (26A) facing the cover section (20) of the frame body (13); a plurality of protruding sections (35) arranged on a lower plane (32A) facing the frame body (13) of the cover section (20) and stored in a recessed section (30); and a solder (38) arranged between the recessed section (30) and the protruding section (35).</p> |
