| 摘要 |
A substrate for forming passive elements in chip type has a top surface, a thickness, multiple parallel grooves, multiple through holes and multiple chip regions. The parallel grooves are formed on the top surface of the substrate. The through holes are formed between and across two adjacent parallel grooves, and each through hole is separated from other through holes and has smooth inner walls. The chip regions are defined between adjacent through holes and parallel grooves and are arranged in a matrix.
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