发明名称 |
Substrate of chip package and chip package structure thereof |
摘要 |
A substrate of chip package and the chip package structure thereof centralizes the bonding area under a chip carrier area and protrudes the bonding area from the chip carrier area to a chip package so as to increase the reliability of bump type surface mount technology during the second-level electronic assembly. Furthermore, the carrier for produce the substrate is recyclable during the chip package procedure so as to reduce the production cost.
|
申请公布号 |
US2007194430(A1) |
申请公布日期 |
2007.08.23 |
申请号 |
US20070699655 |
申请日期 |
2007.01.29 |
申请人 |
TAIWAN SOLUTIONS SYSTEMS CORP. |
发明人 |
LIN CHI CHIH;SUN BO;WANG HUNG JEN |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|