| 摘要 |
PROBLEM TO BE SOLVED: To increase clearance between the edge ends of a semiconductor chip and lead terminal of a tape substrate, while suppressing the hight of a bump electrode. SOLUTION: A bonding stage 16 is configured so that the edge ends 16a of the bonding stage 16 is right at the position of the edge ends 35a of the semiconductor chip 35. The semiconductor chip 35 is mounted on the tape substrate 31, while sucking the tape substrate 31 through a suction groove 17. COPYRIGHT: (C)2007,JPO&INPIT
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