| 摘要 |
PROBLEM TO BE SOLVED: To provide a slim, thin and long integrated circuit device and an electronic equipment including the same, to which anti-electrostatic discharge measures are applied. SOLUTION: The integrated circuit device has pad rows 220, 222 in which a plurality of pads 200A, 200B are arranged, and a plurality of electrostatic discharge protection elements D1, D2 arranged in the lower layer of the pad row and connected respectively to the each pad of the pad row of the row N. Each of electrostatic discharge protection elements DI1, DI2 is arranged in the lower layer of the region including respectively at least the each of the n pads of 200A, 200B configured by one each of the pad rows 220, 222 of the row N, and connected respectively to the one of the n pad 200A, 200B. COPYRIGHT: (C)2007,JPO&INPIT
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