| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and highly reliable composite sensor package by solving the problem that a conventional composite sensor package is hermetically sealed or resin-sealed for each mounted MEMS sensor or each electronic component and this causes large spread in a face direction, resulting in the limit of miniaturization. SOLUTION: The composite sensor package 1 has a silicon substrate 2; one or more MEMS sensors 4 and one or more electronic components 5 mounted on one surface of the silicon substrate 2; a cap 6 joined to the silicon substrate 2 so as to cover the MEMS sensors 4 and the electronic components 5; and a plurality front/rear conducting vias 3 formed on the silicon substrate 2. COPYRIGHT: (C)2007,JPO&INPIT
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