发明名称 MOLD RELEASE AGENT APPLICATION DEVICE AND MOLD RELEASE AGENT APPLICATION METHOD
摘要 PROBLEM TO BE SOLVED: To thinly apply a mold release agent formed out of powder evenly all over a core wire before covering it with a sheath. SOLUTION: This mold release agent application device 11 for applying the mold release agent 13 formed out of powder to the circumferential surface of the core wire 12 includes: a mold release agent tank 21 for storing the mold release agent 13; an entrance 21a and an exit 21b of the core wire 12 formed at positions sunk into the mold release agent 13 on a side surface of the mold release agent tank 21; and agitation means 31 and 32 arranged on the side of a core wire path 25 connecting the entrance 21a to the exit 21b by a straight line for running the core wire 12 therein, and used for running and circulating the mold release agent 13 to bring it close to the core wire path 25. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007213846(A) 申请公布日期 2007.08.23
申请号 JP20060029624 申请日期 2006.02.07
申请人 FUJI DENSEN KOGYO KK 发明人 SAKAMOTO MASARU;NAGANO MASAKI
分类号 H01B13/22;B05C3/04;B05C3/12;B05C19/00;B05D7/20 主分类号 H01B13/22
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