| 摘要 |
A semiconductor module of the present invention includes a wiring substrate having a wiring layer, a passive component mounted to be connected to the wiring layer in a center major portion of the wiring substrate, a resin portion formed selectively in an area except the wiring layer on a peripheral side of the wiring substrate to seal the passive component, and a semiconductor chip mounted on the resin portion and connected to the wiring layer on the peripheral side of the wiring substrate via a wire.
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