发明名称 Multi-chip device and method for manufacturing the same
摘要 A multi-chip device includes LED sensors for sensing light separated by a predetermined interval in a wafer, LEDs for emitting light formed over the wafer respectively corresponding to the LED sensors, a driving circuit formed between the LEDs over the wafer, an insulating film over the wafer, and trenches in the insulating film exposign the LEDs.
申请公布号 US2007197025(A1) 申请公布日期 2007.08.23
申请号 US20060525160 申请日期 2006.09.22
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KANG HEE BOK
分类号 H01L21/4763 主分类号 H01L21/4763
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