METHOD FOR PRODUCING ELECTRONIC COMPONENTS

摘要

The method serves for producing electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is produced on a wafer. An insulating oxide layer is then applied. A protective metal layer (6) is subsequently applied, the metal layer (6) being applied in sections only in those regions of the wafer in which no splitting, for example by mechanical separation, is effected later. The electronic components thus formed in the wafer are then divided up into individual elements.