| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce resin mold flash on an interface terminal in a memory card having the card substrate in which the interface terminal is formed in the same surface as the surface where a semiconductor chip is mounted. <P>SOLUTION: A card substrate 1 comprises base material 1a and solder resist 1b covering the surface and the rear face of the base material 1a and the semiconductor chip is mounted on the surface. A plurality of interface terminals 4 are exposed from the solder resist 1b on the surface of the card substrate 1, the interface terminal 4 is exposed from resin 10 covering the semiconductor chip, furthermore, between the resin 10 and the interface terminals 4, one belt shaped area (a solder resist remover 11) where all or a part of the solder resist 1b is removed in a direction toward thickness is arranged. <P>COPYRIGHT: (C)2007,JPO&INPIT |
