| 摘要 |
A high-frequency package comprising a dielectric substrate, a high-frequency element that operates in a high-frequency region and is mounted in a cavity formed on said dielectric substrate, and a microstrip line formed on the surface or in an inner portion of said dielectric substrate and electrically connected to said high-frequency element, wherein a signal transmission passage of a waveguide is connected to a linear conducting passage or to a ground layer constituting the microstrip line. In the junction portion of the waveguide, for example, an end of the linear conducting passage is electromagnetically opened, so that the end portion works as a monopole antenna inside the waveguide that is connected. The high-frequency package makes it possible to connect the waveguide without adversely affecting the sealing of the high-frequency element and to transmit high-frequency signals with a low loss. <IMAGE> |
