| 摘要 |
A heat-curable silicone composition is provided to form cured products that are superior in hardness, transparency, heat resistance, and light resistance and do not show white turbidity when restored to room temperature after a high-temperature and high-humidity standing. A heat-curable silicone composition comprises: an organopolysiloxane which is represented by the formula of R^1n(C6H5)mSiO(4-n-m)/2 and has 0.5-10% by mass of a hydroxyl group; an organohydrogenpolysiloxane which is represented by the formula of R^2aHbSiO(4-a-b)/2 and contains at least two silicon atom-bonded hydrogen atoms per molecule; a catalytic amount of an addition reaction catalyst; and one, two or more compounds selected from organohydrogenpolysiloxanes containing epoxy groups and/or alkoxy groups, organosilanes containing epoxy groups and/or alkoxy groups, and non-silicon-based epoxy compounds. |
