| 摘要 |
A semiconductor chip having a solder bump formed thereon and a manufacturing method thereof are provided to increase a junction area with a solder by forming an adhesion enhance layer. One or more lower metal adhesion layers(203) are formed on an electrode pad(201) of a semiconductor chip(100). An adhesion enhance layer(300) is formed on the lower metal adhesion layer. A solder bump is formed on the adhesion enhance layer. The adhesion enhance layer has one or more uneven units on an upper surface thereof. The adhesion enhance layer is comprised of one of Cu, Cu-alloy, Ni, Ni-alloy, palladium(Pd), and Pd-alloy. The adhesion enhance layer is formed by sputtering or a coating process. After a photoresist pattern is formed on the upper surface of the adhesion enhance layer by using a mask, the uneven unit is formed by wet-etching a part except for the formed pattern. |
