SEMICONDUCTOR PRESSURE SENSOR APPARATUS

摘要

A semiconductor pressure sensor is provided to prevent a lead from being corroded by penetration of moisture or avoid the failure of seal caused by penetration of gas by sealing a boundary between a case and second rein by adhesive wherein the boundary functions as a penetration path of moisture or gas. A semiconductor pressure sensor part(6) converts pressure into an electrical signal. A terminal(2) through which the semiconductor pressure sensor part and a part of a sensor module(3) are drawn to the outside is insert-molded by first resin. The sensor module is received in an external case(1) wherein the sensor module is insert-molded by second rein to form a connector part of the terminal. A boundary part between the exposed part of the sensor module and the second resin is covered with adhesive. The exposed part of the sensor module from the second resin can be at least a semiconductor pressure sensor mounting part.