HEAT DISSIPATION WIRING BOARD AND METHOD OF MANUFACTURING SAME

摘要

PROBLEM TO BE SOLVED: To take measures against the problem that it is difficult to mount an electronic component requiring a large current and heat dissipation such as a conventional LED on the same substrate as that of other general electronic components.

SOLUTION: Using a different thickness lead frame 100 having partially different thicknesses, a special electronic component requiring a large current and heat dissipation such as an LED 102 is mounted on its thick portion 112, and its thin portion 114 is made to be a fine-pitch wiring to highly densely mount the general electronic components. This configuration can deal with unitization or modularization of electronic components requiring excellent heat dissipation and a large current.

COPYRIGHT: (C)2007,JPO&INPIT