| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer dividing method capable of carrying out a wafer from a chuck table of a semiconductor wafer laser processing device without rupturing the wafer. SOLUTION: The wafer dividing method comprises: a wafer holding step of holding a wafer 2 on a chuck table 41 for holding a processed object of a laser processing device; a deterioration layer forming step of irradiating the wafer 2 with laser rays with wavelength having permeability along a planned division line to form a deterioration layer along the planed division line inside the wafer 2; a wafer supporting step of adhering an adhesive tape 50 fitted to a circular frame 5 on the top face of the wafer 2 supported by the chuck table 41; and a wafer dicing step of, after performing the wafer supporting step, carrying out the wafer 2, which is supported via the adhesive tape 50 fitted to the circular frame 5, from the chuck table 41, and dicing the wafer 2 by applying an external force to the wafer 2 along the planned division line which is formed with the deterioration layer. COPYRIGHT: (C)2007,JPO&INPIT |
