发明名称 CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible circuit board which is superior in radiation property, noise resistance, and a voltage resistance characteristic. SOLUTION: In the circuit board; an insulating layer, and a conductor circuit or metal foil are alternately laminated. Thickness of the conductor circuit or metal foil is 5 to 450μm. The insulating layer is formed of a curing object of resin composition containing inorganic filler and thermosetting resin. Thickness of the insulating layer is 20 to 300μm. At least one through-hole used for electrically connecting the conductor circuits or metal foil is 0.0078 mm<SP>2</SP>. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007214202(A) 申请公布日期 2007.08.23
申请号 JP20060030024 申请日期 2006.02.07
申请人 DENKI KAGAKU KOGYO KK 发明人 YASHIMA KATSUNORI;OKAJIMA YOSHIHIKO
分类号 H05K3/46;H01L23/14 主分类号 H05K3/46
代理机构 代理人
主权项
地址