| 摘要 |
An LED backlight unit which can be assembled without a thermosetting adhesive, improved in heat radiation effects to maintain high brightness, and also significantly improved in productivity. A light source has a substrate and a plurality of light emitting diodes disposed on the substrate. A light guide plate is placed adjacent to the light source. A chassis fixes the light source and the light guide plate therein. Fixing means engagingly fit a side of the light guide plate into the light source plate and chassis. Here, the substrate of the light source is fixed in surface contact with the chassis. The light guide plate assemblable without a thermosetting adhesive facilitates assembling and ensures effective radiation of heat generated from the LED, thereby maintaining high brightness and achieving superb light emitting capability.
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