| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation plate mounting structure where a large heat dissipation area can be obtained for the fixing space, without increasing the height of the heat dissipation plate. SOLUTION: The heat dissipation plate 2 mounted on a wiring board 1 has a heat dissipation plate main portion 21, to which a heating component 3 is fixed, and an extension plate 25 that is flush with the heat dissipation plate main portion 21, extending continuously sideways therefrom. The heat dissipation plate 2 is fixed to the wiring board 1, while overlapping the root side edge 21a of the heat dissipation plate main portion 21 on the plate surface of the wiring board 1. A component 100, mounted on the wiring board 1, is arranged in the opposing space of the extension plate 25 and the wiring board 1. A rectangular plate piece 41, provided continuously to the edge in the widthwise direction of the heat dissipation plate main portion 21, is bent at right angles with respect to the heat dissipation plate main portion 21 as a support leg 4. COPYRIGHT: (C)2007,JPO&INPIT |
