| 摘要 |
A semiconductor device ( 10 ) includes: a substrate ( 1 ), including an electrode pad ( 1 a); an IC chip ( 4 ), mounted on the substrate ( 1 ); and an externally connecting terminal ( 7 ), formed on the electrode pad ( 1 a) and electrically connected with the IC chip ( 4 ), the externally connecting terminal ( 7 ) including a resin core ( 7 a) made of an elastic material and including a metal layer ( 7 b) formed outside the resin core ( 7 a), thereby providing a semiconductor device having high packaging reliability.
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