Verbinden von piezoelektrischem Element und Elektrode für einen Mikroaktor

摘要

A method of bonding a piezoelectric element 28a and an electrode 24, 26, in which a first coating 46, 48 of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn is formed on a bonding surface of the piezoelectric element, and a second coating 50, 52 of a material selected from the same group is formed on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure, perhaps ultrasonically, to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode. Alternatively a solder bond can be used. These methods reduce the risk of a short-circuit between the two electrodes.