| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which sub runners can be removed without deforming a lead frame even if an extra-thin lead frame is used. <P>SOLUTION: The method of manufacturing a resin-sealed semiconductor device by fixing a semiconductor device to a die pad of a lead frame, and sealing it by a resin comprises: a resin sealing step P1 for implanting and filling a resin into a semiconductor device-sealing package from a main runner by way of a plurality of sub runners via a gate, a main runner removing step P2 for removing the main runner, a cutting off step P3 for cutting off the gate, a deburring step P4 for injecting a high pressure stream onto the lead frame to remove burrs, and a sub runners removing step P6 for peeling off and removing the sub runners from the top of the lead frame. The sub runners removing step P6 is performed after at least the deburring step P4. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
