| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board by which low cost and high quality can be established. SOLUTION: The method of manufacturing a circuit board includes a step to prepare a hard board; a step wherein an adhesive sheet with mold-releasing sheets on both surfaces are prepared, and a central area and a peripheral area are cut off to the mold-releasing sheet on one surface of the adhesive sheet a semi-cutting means; a step wherein the mold-releasing sheet on the other surface of the adhesive sheet is removed, and it is adhered to both surfaces of the hard board; a step wherein the peripheral area of the mold-releasing sheet left on the adhesive sheet is removed to expose an adhesive part of the peripheral area; a step wherein at least multi-layer circuit boards including at least one layer of a copper metal layer, an insulating layer, and a copper metal layer are stacked in order on both surfaces of the board with the adhesive sheets; a step wherein an adhered part (peripheral area) between the adhesive sheet and the multi-layer circuit board is cut not to allow the board and the multi-layer circuit board not to be adhered to each other by the central area; and a step wherein the multi-layer circuit board and the board are separated to complete the manufacturing of the circuit board. COPYRIGHT: (C)2007,JPO&INPIT |
