发明名称 MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To enhance an adhesive property of each of an insulating sheet, a metal wiring, and an interlayer insulating film to prevent a separation. SOLUTION: After a part or all of the metal wiring is buried in a temporarily cured layer 6 formed at a predetermined depth in a crust of an insulating sheet 1, it is fully cured and the interlayer insulating film is formed thereon. A sectional structure in a widthwise direction of the metal wiring is formed as a trapezoidal shape in which a length of a side coming into contact with the insulating sheet 1 is longer than a length of a side coming into contact with the interlayer insulating film, or a two-step trapezoidal shape formed by jointing short sides of the two trapezoids to each other. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007214216(A) 申请公布日期 2007.08.23
申请号 JP20060030360 申请日期 2006.02.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 RI SHINKA
分类号 H05K3/46 主分类号 H05K3/46
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