| 摘要 |
PROBLEM TO BE SOLVED: To easily ensure test object processing, such as seeding the test object to a well of well plate. SOLUTION: The through hole is formed through the substrate from the surface to the rear face of the substrate, the through hole is blocked by sticking a transparent thin plate of 50 to 200μm thick, and a plurality of wells are formed on the upper face of the internal side of the through hole. Since the well is formed on the surface of the thin plate of 50 to 200μm thickness, the inspection objective body in the well can be observed from the rear side with an inverted microscope, therefore processing the inspection objects, such as seeding the inspection object can be performed easily and surely, without being obstructed by the objective lens of the microscope. COPYRIGHT: (C)2007,JPO&INPIT
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