| 摘要 |
An epoxy resin composition for semiconductor encapsulation which has good solder heat resistance and excellent productivity, and a semiconductor device. An epoxy resin composition is described for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, (C) (C-1) an organopolysiloxane having a carboxyl group and/or (C-2) a reaction product between an organopolysiloxane having a carboxyl group and an epoxy resin, and (D) a tri-fatty acid ester of glycerol.
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