METHOD AND DEVICE FOR ETCHING SUBSTRATES RECEIVED IN AN ETCHING SOLUTION,申请号EP20050817850-传众专利搜索

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发明名称	METHOD AND DEVICE FOR ETCHING SUBSTRATES RECEIVED IN AN ETCHING SOLUTION
摘要
申请公布号	EP1820207(A2)	申请公布日期	2007.08.22
申请号	EP20050817850	申请日期	2005.12.07
申请人	ASTEC HALBLEITERTECHNOLOGIE GMBH	发明人	SCHWECKENDIEK, JUERGEN;FRANZKE, JOERG;NIESE, MATTHIAS;OSTERKAMP, JUERGEN
分类号	H01L21/00	主分类号	H01L21/00
代理机构		代理人
主权项
地址

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