发明名称 |
METHOD AND SYSTEM FOR LASER HARD MARKING |
摘要 |
<p>A method and system for laser hard marking is provided. The laser-marking system produces a hard mark on a semiconductor wafer. The system includes a pulsed laser subsystem that produces a pulsed laser output for marking at a location on the wafer. The pulsed laser subsystem is controlled so that output pulse width remains substantially constant with a variation in at least one of pulse repetition rate and output energy over a range. A beam delivery system delivers the pulsed laser output to the location on the wafer.</p> |
申请公布号 |
EP1819476(A1) |
申请公布日期 |
2007.08.22 |
申请号 |
EP20050819869 |
申请日期 |
2005.11.11 |
申请人 |
GSI GROUP CORPORATION |
发明人 |
GU, BO |
分类号 |
B23K26/02;B23K26/06;B23K26/36;B23K26/40;B41J2/47;H01L21/00;H01L21/67;H01L23/544 |
主分类号 |
B23K26/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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