| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem of failure of electric connection in substrate with built-in electronic element. <P>SOLUTION: A plurality of insulating layers made of organic material are laminated and a with conductor 3 is formed on the surface of an insulating layer 1. The wiring conductors 3 with the insulating layer 1 in between are connected with a through conductor 4 made of a conductive material filled in a through hole formed in the insulating layer 1. In the multilayer wiring substrate, an electronic element 6 having a terminal electrode 5 connected with the through conductor 4 is built in a hollow space 8 formed at least one layer of the insulating layers 1. The terminal electrode 5 has a surface layer 5a containing tin at a connection part with the through conductor 4. The through conductor 4 is made of conductive material containing indium, and a compound of tin and indium is formed at the connection part. <P>COPYRIGHT: (C)2004,JPO</p> |
