| 摘要 |
A contoured circuit board 1 is manufactured via the steps of providing at least one substrate formed of thermo-plastic material, applying a thermoplastic conductive ink onto the at least one substrate to form conducting tracks 2 , and then thermo-forming the at least one substrate into a contoured shape. A pair of such contoured circuit boards are then overlaid, a first contoured circuit board having conducting elements formed on an upper surface and a second contoured circuit board having a complementary shape to, being overlaid on and spaced apart from the first contoured circuit board, said second contoured circuit board having conducting elements formed on a lower surface which faces said upper surface of the first contoured circuit board, whereby pressing of one of said first and second contoured circuit boards towards the other effects contact between the conducting elements formed on the two boards so as to effect an electrical connection therebetween. |
